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| PRELIMINARY TECHNICAL DATA a Preliminary Technical Data FEATURES 1 MHz PWM Frequency Ultrasmall 8-lead 3x3 Sq. mm Chip Scale Package Automatic PWM to Power Saving Mode at Light Load Fully Integrated 1.5 A Power Switch 3% Output Regulation Accuracy over Temperature, Line, and Load 100% Duty Cycle Operation Simple Compensation Output Voltage: 1.25 V to 10 V Small Inductor and MLC Capacitors Low Quiescent Current while Pulse Skipping Thermal Shutdown Fully Integrated Soft Start Cycle-by-cycle Current Limit APPLICATONS PDAs and Palmtop Computers Notebook Computers PCMCIA Cards Bus Products Portable Instruments Industrial Systems GENERAL DESCRIPTION IN IN 1 MHz, 1 A Buck Regulator ADP3089 FUNCTIONAL BLOCK DIAGRAM SW CURRENT SENSE PWM 1MHz AMP COMPARATOR SQ R DRV PROTECTION LOGIC (ILIM, OT) ERROR AMP gm RUN/STOP COMPARATORS FB SOFT-START TIMER COMP GND GND + REF 1.245V VIN 10F ADP3089 SW IN 0.1F IN GND COMP DRV GND FB 10H 20BQ030 18.2k 22F 41.2k VOUT 1.8V@1A The ADP3089 is a high frequency, non-synchronous PWM step-down DC-DC regulator with an integrated 1.5 A power switch in a space-saving chip scale package. It provides high efficiency, excellent dynamic response, and is very simple to use. The ADP3089's 1 MHz switching frequency allows for small, inexpensive external components, and the current mode control loop is simple to compensate and eases noise filtering. It operates in PWM current mode under heavy loads and saves energy at lighter loads by switching automatically into Power Saving mode. Soft start is integrated completely on chip, as is the cycle-by-cycle current limit. Capable of operating from 2.5 V to 11 V input with a typical output current of 1 A, it is ideal for portable, battery powered, industrial, PC and instrumentation applications. Supporting output voltages down to 1.25 V, the ADP3089 is ideal to generate low voltage rails, providing the optimal solution in its class for delivering power efficiently, responsively, and simply with minimal printed circuit board area. The device is specified over the industrial temperature range of -40C to +85C, and is offered in an ultrasmall 8lead 3x3 square mm chip scale package. REV. PrE 8/26/02 47pF 470pF 10.7k Figure 1. Typical Application Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P Box 9106, Norwood, MA 02062-9106, U.S.A. .O. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 Analog Devices, Inc., 2002 PRELIMINARY TECHNICAL DATA ADP3089-SPECIFICATIONS1 (V = +3.3 V, T = -40C to +85C, unless otherwise noted) IN A Parameter SUPPLY Input Voltage Range Quiescent Current Operating Symbol VIN IQ ISD IGND2 TSD f SW D PSM D MAX VHYST VIO3 ILIM Conditions DRV to GND VIN = 10 V, IL = 1 A, DRV = GND No load VCOMP = 0 V VIN = 10 V, IL = 1 A, DRV = 2 V Min 2.5 Typ Max 11 Units V mA 12 180 15 3 160 0.75 100 20 1 14 30 .7 1.5 1.7 0.5 1.25 280 40 3.6 Shutdown Ground Current Normal Operation Thermal Shutdown Threshold OSCILLATOR Oscillator Frequency Minimum Sleep Duty Cycle Maximum Duty Cycle Wake up Hysteresis OUTPUT SWITCH Switch On Voltage Current Limit Threshold Leakage Current ERROR AMPLIFIER Reference Voltage Accuracy Reference Voltage Line Regulation Feedback Input Bias Current Maximum Output Current Short Circuit Current Transconductance MODULATOR Transconductance Control Offset Voltage Soft Start Time Shutdown Threshold Voltage Slope Compensation A A mA C MHz % % mV V A A V %/V nA A A A/V A/V V s mV A/s FB voltage drops below VREF IL = 1A, FB and DRV tied to GND 40 1.0 2 VIN = 12 V VREF I FB ICOMP, ICOMP, gm , EA FB tied to COMP FB tied to COMP, VIN = 3 V to 12 V soft start expired SC SD 1.222 1.245 1.265 .02 1 60 20 480 1 0.90 250 50 85 40 -50 35 VCOMP = 0 V, activating shutdown VFB to ICOMP VCOMP to IL 340 Effectively summed to ISW gm, MOD VPWM, OS t SS VCOMP, SD mSC 600 750 0.5 NOTES 1 All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC). 2 For higher efficiency operation, tie the DRV pin to the output for IL < 250 mA, and V IN > 3 V. 3 V(IN) - V(SW), includes voltage drop across internal current sensor. Specifications subject to change without notice. -2- REV. PrE PRELIMINARY TECHNICAL DATA ADP3089 ABSOLUTE MAXIMUM RATINGS* PIN FUNCTION DESCRIPTIONS Input Supply Voltage .............................. -0.3 V to +12 V Voltage on any pin with respect to GND ............................................................ -0.3 V to +12 V (voltage on any pin may not exceed VIN) Operating Ambient Temperature Range .. -40C to +85C Operating Junction Temperature ......................... +125C JA (4-layer board) ............................................... 47C/W Storage Temperature Range .................. -65C to +150C Lead Temperature Range (Soldering, 10 sec) ..... +240C Vapor Phase (60 sec) ........................................ +240C Infrared (20 sec) ............................................... +240C *This is a stress rating only; operation beyond these limits can cause the device to be permanently damaged. Unless otherwise specified, all voltages are referenced to GND. Pin 1, 2 3, 6 4 Mnemonic IN GND COMP Function Power Supply Input. Both pins must be connected. Ground. Both pins must be connected. Feedback Loop Compensation and Shutdown Input. An open drain or collector used to pull the pin to ground will shutdown the device. Feedback Voltage Sense Input. This pin senses the voltage via an external resistor divider. This pin provides a separate path for drive current to be connected to ground. Switching Output. 5 FB 7 DRV 8 SW ORDERING GUIDE PIN CONFIGURATION Model Temperature Range Package Option Branding Information IN IN GND COMP 1 2 TOP VIEW* ADP3089ACP -40C to +85C CSP-8 3x3 P7A 8 7 6 5 SW DRV GND FB 3 4 * PIN'S UNDERSIDE CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the device features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. REV. PrE -3- PRELIMINARY TECHNICAL DATA ADP3089 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 8 Lds Lead Frame Chip Scale Package (LFCSP) 3 x 3 mm Body (CP-08) 3.00 (0.1181) BSC SQ 4 0.60 (0.0236) 0.24 (0.0094) 0.50 (0.0197) 0.30 (0.0118) PIN 1 INDICATOR 0.45 (0.0177) PIN 1 INDICATOR TOP VIEW 1 2.75 (0.1083) BSC SQ 0.50 (0.0197) BSC 0.25 (0.0098) MIN 1.50 (0.059) REF 2.25 (0.0886) 2.05 (0.0807) BOTTOM VIEW 0.90 (0.0354) MAX 0.85 (0.0335) NOM 0.70 (0.0276) MAX 0.65 (0.0256) NOM 0.30 (0.0118) 0.18 (0.0071) DETAIL A 1.25 (0.0492) 0.95 (0.0374) 12 MAX COPLANARITY 0.05 (0.0020) MAX 0.01 (0.0004) NOM SEATING PLANE 0.20 (0.0079) REF DETAIL A SEATING PLANE CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN -4- REV. PrE |
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